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Thermally conductive heat transfer paste, often referred to as thermal paste, thermal compound, or thermal grease, is a substance used to improve the efficiency of heat transfer between two surfaces, typically between a computer processor (CPU) or a GPU and a heatsink or cooling solution.

The main purpose of thermal paste is to fill the microscopic air gaps and imperfections between two surfaces (e.g., a CPU and a heatsink), which would otherwise impede heat transfer. These gaps are caused by the fact that no surface, even polished ones, is perfectly flat at a microscopic level. Air is a poor conductor of heat, so by filling these gaps with a thermally conductive material, the paste ensures that heat is efficiently transferred from the CPU or GPU to the heatsink or cooling system.

1. Ceramic-Based Pastes:
   • Made from ceramic compounds like aluminum oxide.
   • Non-conductive (electrically), making them safe to use around electrical components.
   • Good performance but typically lower thermal conductivity compared to metal-based pastes.
2. Metal-Based Pastes:
   • Contains metal particles (e.g., silver, copper, or aluminum).
   • Higher thermal conductivity, making them ideal for high-performance cooling applications.
   • Some metal-based pastes may be electrically conductive, so care is needed during application to avoid short circuits.
3. Carbon-Based Pastes:
   • Made with carbon or graphite-based materials, often offering high thermal conductivity while being non-conductive electrically.
   • Generally, these are used in specialized applications where high performance is required, but electrical conductivity is a concern.

1. Thermal Conductivity:

   • This is the primary metric of performance. Higher thermal conductivity means better heat transfer.
   • Measured in watts per meter per Kelvin (W/m·K). Typical pastes range from 1 to 10 W/m·K, with high-end pastes reaching 12-13 W/m·K or more.

2. Viscosity:

   • The paste needs to be viscous enough to spread evenly but not too runny, as this could lead to spillage or uneven application.

3. Electrical Conductivity:

   • Some thermal pastes are electrically conductive, which can cause a short circuit if it spills onto sensitive components. Non-conductive pastes are safer for general use in most applications.

4. Durability and Longevity:

   • Good thermal paste should maintain its properties over time without drying out, cracking, or losing thermal conductivity.

1. Clean the surfaces: Before applying the paste, ensure the CPU/GPU and heatsink are free of dust, old thermal paste, and oils. Use isopropyl alcohol and a lint-free cloth or paper towel.

2. Apply a small amount of paste: A small pea-sized amount is typically sufficient. Some people prefer to use a line or X shape.

3. Spread (optional): Some prefer to spread the paste evenly with a tool (such as a plastic card) or by pressing the heatsink onto the CPU. However, many modern thermal pastes are designed to spread evenly under pressure, so just placing the heatsink directly onto the CPU is often enough.

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